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Study of direct Cu electrodeposition on ultra-thin Mo for copper interconnect
Wang, Xu, Cao, Li-Ao, Yang, Guang, Qu, Xin-PingVolume:
164
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.07.001
Date:
October, 2016
File:
PDF, 2.71 MB
english, 2016