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Simulation research on the influence of stress relaxation on plastic IC delamination during scrapped PCB disassembly
Long, Danfeng, Xiang, Dong, Dong, Yehong, Duan, GuanghongVolume:
14
Year:
2011
Language:
english
Journal:
International Journal of Environmental Technology and Management
DOI:
10.1504/ijetm.2011.043517
File:
PDF, 390 KB
english, 2011