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Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling
Tunga, Krishna, Sitaraman, Suresh K.Volume:
2
Year:
2008
Language:
english
Journal:
International Journal of Materials and Structural Integrity
DOI:
10.1504/ijmsi.2008.018906
File:
PDF, 701 KB
english, 2008