Measurement of the local residual stress between fine...

Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures

Nakahira, Kota, Tago, Hironori, Sasaki, Takuya, Suzuki, Ken, Miura, Hideo
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Volume:
8
Year:
2014
Language:
english
Journal:
International Journal of Materials and Structural Integrity
DOI:
10.1504/ijmsi.2014.064770
File:
PDF, 770 KB
english, 2014
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