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Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures
Nakahira, Kota, Tago, Hironori, Sasaki, Takuya, Suzuki, Ken, Miura, HideoVolume:
8
Year:
2014
Language:
english
Journal:
International Journal of Materials and Structural Integrity
DOI:
10.1504/ijmsi.2014.064770
File:
PDF, 770 KB
english, 2014