Post-ion beam induced degradation of copper layers in transmission electron microscopy specimens
Seidel, F, Richard, O, Bender, H, Vandervorst, WVolume:
30
Language:
english
Journal:
Semiconductor Science and Technology
DOI:
10.1088/0268-1242/30/11/114016
Date:
November, 2015
File:
PDF, 1.72 MB
english, 2015