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[IEEE Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) - Norrkoping, Sweden (26-30 Oct. 1997)] Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) - Measurements of solder bump lifetime as a function of underfill material properties

Nysaether, J.B., Lundstrom, P., Liu, J.
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Year:
1997
Language:
english
DOI:
10.1109/pep.1997.656504
File:
PDF, 699 KB
english, 1997
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