SPIE Proceedings [SPIE Asia Pacific Symposium on Microelectronics and MEMS - Gold Coast, Australia (Wednesday 27 October 1999)] Device and Process Technologies for MEMS and Microelectronics - Stress effect on the via crack of IMD structure in scrubber processing
Huang, D. F., Yeh, R. S., Lin, Tse-Yu, Hung, Chih-Chien, Lin, T. C., Chang, Chao-Hsin, Chen, Chia-Hsiang, Chau, Kevin H., Dimitrijev, SimaVolume:
3892
Year:
1999
Language:
english
DOI:
10.1117/12.364507
File:
PDF, 872 KB
english, 1999