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SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and Nanofabrication - San Jose, CA (Saturday 19 January 2008)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - A perspective on the reliability of MEMS-based components for telecommunications
McNulty, John C., Hartzell, Allyson L., Ramesham, RajeshuniVolume:
6884
Year:
2008
Language:
english
DOI:
10.1117/12.773640
File:
PDF, 1.24 MB
english, 2008