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Reliability study of Au-in solid-liquid interdiffusion bonding for GaN-based vertical LED packaging
Sung, Ho-Kun, Wang, Cong, Kim, Nam-YoungVolume:
25
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/25/12/127002
Date:
December, 2015
File:
PDF, 1.16 MB
english, 2015