Assessment of board level solder joint reliability for PBGA...

Soldering & Surface Mount Technology 2002 / 12 Vol. 14; Iss. 3

Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders

Ricky Lee, Shi‐Wei, Hoi Wai Lui, Ben, Kong, Y.H., Baylon, Bernard, Leung, Timothy, Umali, Pompeo, Agtarap, Hector
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Volume:
14
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910210444728
Date:
December, 2002
File:
PDF, 656 KB
english, 2002
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