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SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V - Improved metal CMP endpoint control by monitoring carrier speed controller output or pad temperature
Beckage, Peter J., Lukner, Ralf, Cho, Wonhui, Edwards, Keith A., Jester, Michael, Shaw, Stephen, Toprac, Anthony J., Dang, KimVolume:
3882
Year:
1999
Language:
english
DOI:
10.1117/12.361299
File:
PDF, 600 KB
english, 1999