Kinetics simulation and a novel curing procedure to avoid...

Kinetics simulation and a novel curing procedure to avoid thermal shock during the curing process of epoxy composites

Dong, Hongxing, Li, Yonghe, Zhang, Jin, Liu, Lijia, Cao, Liying, Ming, Pingjian, Liu, Wenjing, Zhang, Chunhong, Liu, Lianhe, Wei, Hao
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Volume:
6
Year:
2016
Language:
english
Journal:
RSC Adv.
DOI:
10.1039/C6RA07448K
File:
PDF, 643 KB
english, 2016
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