Limits of copper plating in high aspect ratio microvias

Limits of copper plating in high aspect ratio microvias

Castaldi, Steve, Fritz, Dennis, Schaeffer, Ron
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Volume:
25
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056129910258324
Date:
June, 1999
File:
PDF, 285 KB
english, 1999
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