![](/img/cover-not-exists.png)
Process characterization and reliability for the assembly of 01005 chip components
Lee, Yong‐Won, Kim, Keun‐Soo, Suganuma, KatsuakiVolume:
23
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911111169084
Date:
September, 2011
File:
PDF, 422 KB
english, 2011