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SPIE Proceedings [SPIE ISMA '97 International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 23 June 1997)] Microelectronic Packaging and Laser Processing - Reliability study of microelectronic packaging assemblies by a multiaxial submicron fatigue tester
Liu, Sheng, Lu, Minfu, Qian, Zhengfang, Ren, Wei, Swee, Yong Khim, Zheng, HongYu, Chen, Ray T.Volume:
3184
Year:
1997
Language:
english
DOI:
10.1117/12.280581
File:
PDF, 1.13 MB
english, 1997