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Bulk copper electrodeposition on gold imaged byin situSTM: morphology and influence of tip potential
J. E. T. Andersen, G. Bech-Nielsen, P. Møller, J. C. ReeveVolume:
26
Language:
english
Pages:
10
DOI:
10.1007/bf00364066
Date:
February, 1996
File:
PDF, 2.78 MB
english, 1996