SPIE Proceedings [SPIE Microelectronics, MEMS, and Nanotechnology - Perth, Australia (Tuesday 9 December 2003)] Device and Process Technologies for MEMS, Microelectronics, and Photonics III - Anodic bond characteristics of Si-wafer and MLCA using Pyrex #7740 glass intermediate layer
Chiao, Jung-Chih, Chung, Gwiy-Sang, Kim, Jae-min, Hariz, Alex J., Jamieson, David N., Parish, Giacinta, Varadan, Vijay K.Volume:
5276
Year:
2003
Language:
english
DOI:
10.1117/12.522858
File:
PDF, 392 KB
english, 2003