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SPIE Proceedings [SPIE Photonics Asia 2007 - Beijing, China (Sunday 11 November 2007)] Light-Emitting Diode Materials and Devices II - A new golden bump making method for high power LED flip chip
Liu, Hongwei, Wang, Jian, Lee, Changhee, Niu, Pingjuan, Hu, Haiyang, Wang, Hezhou, Chen, Hongda, Xia, ZhiweiVolume:
6828
Year:
2007
Language:
english
DOI:
10.1117/12.760274
File:
PDF, 482 KB
english, 2007