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SPIE Proceedings [SPIE Micromachining and Microfabrication - San Jose, CA (Saturday 25 January 2003)] Micromachining and Microfabrication Process Technology VIII - Wafer thinning for high-density, through-wafer interconnects
Wang, Lianwei, Visser, Cassan C. G., de Boer, Charles R., Laros, M., van der Vlist, W., Groeneweg, J., Craciun, G., Sarro, Pasqualina M., Yasaitis, John A., Perez-Maher, Mary Ann, Karam, Jean MichelVolume:
4979
Year:
2003
Language:
english
DOI:
10.1117/12.473374
File:
PDF, 701 KB
english, 2003