Application of direct bonded copper substrates for...

Circuit World 2016 / 02 Vol. 42; Iss. 1

Application of direct bonded copper substrates for prototyping of power electronic modules

Grzesiak, Wojciech, Maćków, Piotr, Maj, Tomasz, Synkiewicz, Beata, Witek, Krzysztof, Kisiel, Ryszard, Myśliwiec, Marcin, Borecki, Janusz, Serzysko, Tomasz, Żupnik, Marek
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Volume:
42
Language:
english
Journal:
Circuit World
DOI:
10.1108/cw-10-2015-0051
Date:
February, 2016
File:
PDF, 822 KB
english, 2016
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