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[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - JACS-Pak/sup TM/ flip-chip chip scale package development and characterization
Lindsey, S.E., Aday, J., Blood, B., Yifan Guo,, Hemann, B., Kellar, J., Koehler, C., Liu, J., Sarihan, V., Tessier, T., Thompson, L., Yeung, B.Year:
1998
Language:
english
DOI:
10.1109/ectc.1998.678741
File:
PDF, 1004 KB
english, 1998