Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs
Song, Jinwook, Park, Shinyoung, Kim, Sukjin, Kim, Jonghoon J., Kim, JounghoYear:
2016
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2582904
File:
PDF, 4.50 MB
english, 2016