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SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Wednesday 1 October 1997)] Multilevel Interconnect Technology - Productivity enhancement by replacing photoresist etchback by chemical-mechanical polishing for interlayer dielectric planarization
Leitner, Klaus, Elbel, Norbert, Koller, Klaus, Patel, Divyesh N., Graef, MartVolume:
3214
Year:
1997
Language:
english
DOI:
10.1117/12.284665
File:
PDF, 514 KB
english, 1997