SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Sunday 20 September 1998)] Multilevel Interconnect Technology II - Inorganic bottom ARC SiOxNy for interconnection levels on 0.18-μm technology
Trouiller, Yorick, Graef, Mart, Patel, Divyesh N., Buffet, N., Mourier, Thierry, Gobil, Yveline, Schiavone, Patrick, Quere, YvesVolume:
3508
Year:
1998
Language:
english
DOI:
10.1117/12.324043
File:
PDF, 2.38 MB
english, 1998