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SPIE Proceedings [SPIE Micromachining and Microfabrication - San Francisco, CA (Monday 22 October 2001)] Micromachining and Microfabrication Process Technology VII - Method of bond strength evaluation for silicon direct wafer bonding
Spivak, Alexander, Avagyan, Avag, Davies, Brady R., Karam, Jean Michel, Yasaitis, John A.Volume:
4557
Year:
2001
Language:
english
DOI:
10.1117/12.442939
File:
PDF, 169 KB
english, 2001