SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and...

  • Main
  • SPIE Proceedings [SPIE MOEMS-MEMS 2008...

SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and Nanofabrication - San Jose, CA (Saturday 19 January 2008)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - Study of Ag-In solder as low temperature wafer bonding intermediate layer

Made, Riko I, Hartzell, Allyson L., Ramesham, Rajeshuni, Gan, Chee Lip, Lee, Chengkuo, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lau, John H.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
6884
Year:
2008
Language:
english
DOI:
10.1117/12.762046
File:
PDF, 2.24 MB
english, 2008
Conversion to is in progress
Conversion to is failed