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SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and Nanofabrication - San Jose, CA (Saturday 19 January 2008)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - Study of Ag-In solder as low temperature wafer bonding intermediate layer
Made, Riko I, Hartzell, Allyson L., Ramesham, Rajeshuni, Gan, Chee Lip, Lee, Chengkuo, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lau, John H.Volume:
6884
Year:
2008
Language:
english
DOI:
10.1117/12.762046
File:
PDF, 2.24 MB
english, 2008