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Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging
Huang, De-Shau, Tu, Wen-Bin, Zhang, Xiu-Ming, Tsai, Liang-Te, Wu, Ti-Yuan, Lin, Ming-TzerLanguage:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.07.006
Date:
July, 2016
File:
PDF, 3.27 MB
english, 2016