Using Taguchi method to obtain the optimal design of heat...

  • Main
  • 2016 / 7
  • Using Taguchi method to obtain the optimal design of heat...

Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging

Huang, De-Shau, Tu, Wen-Bin, Zhang, Xiu-Ming, Tsai, Liang-Te, Wu, Ti-Yuan, Lin, Ming-Tzer
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.07.006
Date:
July, 2016
File:
PDF, 3.27 MB
english, 2016
Conversion to is in progress
Conversion to is failed