The impact of underfill properties on the thermomechanical...

Soldering & Surface Mount Technology 2000 / 08 Vol. 12; Iss. 2

The impact of underfill properties on the thermomechanical reliability of FCOB assembly

Lu, Jicun, Wu, Jianhua, Pin Liew, Yih, Beng Lim, Thiam, Zong, Xiangfu
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Volume:
12
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910010331455
Date:
August, 2000
File:
PDF, 383 KB
english, 2000
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