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Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
Chang, Yuan-Wei, Cheng, Yin, Xu, Feng, Helfen, Lukas, Tian, Tian, Di Michiel, Marco, Chen, Chih, Tu, King-Ning, Baumbach, TiloVolume:
117
Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2016.06.059
Date:
September, 2016
File:
PDF, 4.84 MB
english, 2016