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On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface
Liashenko, O.Y., Lay, S., Hodaj, F.Volume:
117
Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2016.07.021
Date:
September, 2016
File:
PDF, 2.94 MB
english, 2016