Moisture effects on adhesion of non‐conductive adhesive...

Soldering & Surface Mount Technology 2010 / 02 Vol. 22; Iss. 1

Moisture effects on adhesion of non‐conductive adhesive attachments

Saarinen, Kirsi, Heino, Pekka
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Volume:
22
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911011015139
Date:
February, 2010
File:
PDF, 193 KB
english, 2010
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