Using Copulas to Model and Simulate Two-dimensional...

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Using Copulas to Model and Simulate Two-dimensional Warranty Data

Anderson, Boyd, Chukova, Stefanka, Hirose, Yuichi
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Year:
2016
Language:
english
Journal:
Quality and Reliability Engineering International
DOI:
10.1002/qre.2043
File:
PDF, 2.42 MB
english, 2016
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