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[ACS Symposium Series] Microelectronics Technology Volume 614 (Polymers for Advanced Imaging and Packaging) || Hydrogen Bonding in Sulfone- and N -Methylmaleimide-Containing Resist Polymers with Hydroxystyrene and Acetoxystyrene
Reichmanis, Elsa, Ober, Christopher K., MacDonald, Scott A., Iwayanagi, Takao, Nishikubo, TadatomiVolume:
10.1021/bk
Year:
1995
Language:
english
DOI:
10.1021/bk-1995-0614.ch011
File:
PDF, 1.74 MB
english, 1995