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Thermal stability of interface voids in Cu grain boundaries with molecular dynamic simulations
Xydou, A, Parviainen, S, Aicheler, M, Djurabekova, FVolume:
49
Language:
english
Journal:
Journal of Physics D: Applied Physics
DOI:
10.1088/0022-3727/49/35/355303
Date:
September, 2016
File:
PDF, 1.24 MB
english, 2016