TBGA reliability in telecom environment

Soldering & Surface Mount Technology 2000 / 08 Vol. 12; Iss. 2

TBGA reliability in telecom environment

Pennanen, Virpi, Tammenmaa, Markku, Reinikainen, Tommi, Zhu, Jiansen, Lin, Wei
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Volume:
12
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910010331509
Date:
August, 2000
File:
PDF, 387 KB
english, 2000
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