Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu...

Ultrasonics Sonochemistry 2017 / 01 Vol. 34

Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

Tan, Ai Ting, Tan, Ai Wen, Yusof, Farazila
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Volume:
34
Language:
english
Journal:
Ultrasonics Sonochemistry
DOI:
10.1016/j.ultsonch.2016.06.039
Date:
January, 2017
File:
PDF, 5.43 MB
english, 2017
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