Effect of Solder-Joint Geometry on the Low-Cycle Fatigue...

Journal of Electronic Materials 2016 / 12 Vol. 45; Iss. 12

Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu

Lee, Hwa-Teng, Huang, Kuo-Chen
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Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4773-1
Date:
December, 2016
File:
PDF, 6.41 MB
english, 2016
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