Thermal aging effects on microstructures and mechanical...

Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy

Gain, Asit Kumar, Zhang, Liangchi, Quadir, M.Z.
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Volume:
110
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2016.08.007
Date:
November, 2016
File:
PDF, 3.34 MB
english, 2016
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