[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Physical vapor deposited AlN as scalable and reliable interconnect etch-stop ≤ 10nm node
He Ren,, Yana Cheng,, Yong Cao,, Guggilla, Srinivas, Kesapragada, Sree, Weifeng Ye,, Naik, MehulYear:
2016
Language:
english
DOI:
10.1109/IITC-AMC.2016.7507646
File:
PDF, 765 KB
english, 2016