[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Direct bonding of a titanium header to an embedded two-phase FEEDS cooling device for high-flux electronics
Deisenroth, David C., Mandel, Raphael K., Greve, Hannes, Dessiatoun, Serguei V., McCluskey, Patrick, Ohadi, Michael M.Year:
2016
Language:
english
DOI:
10.1109/ITHERM.2016.7517666
File:
PDF, 1.56 MB
english, 2016