[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Heat Dissipation Enhancement of 2.5D Package with 3D Graphene and 3D Boron Nitride Networks as Thermal Interface Material (TIM)
Loeblein, Manuela, Tsang, Siu Hon, Han, Yong, Zhang, Xiaowu, Teo, Edwin Hang TongYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.85
File:
PDF, 1.34 MB
english, 2016