[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Negative impact of certain adhesive configurations on solder joint reliability of package on package architecture: A comprehensive experimental and numerical study
Tripathi, Shantanu, Han, Ru, Vujosevic, MilenaYear:
2016
Language:
english
DOI:
10.1109/itherm.2016.7517638
File:
PDF, 463 KB
english, 2016