Wafer Scale Variation of Planarization Length in Chemical Mechanical Polishing
Oji, Charles, Lee, Brian, Ouma, Dennis, Smith, Taber, Yoon, Jung, Chung, James, Boning, DuaneVolume:
147
Year:
2000
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1394060
File:
PDF, 495 KB
english, 2000