Employment of roll-offset printing for fabrication of solder bump arrays: Harnessing the rheological properties of lead-free solder pastes using particle size distribution
Son, Min-Jung, Kim, Inyoung, Yang, Sangsun, Lee, Taik-Min, Lee, Hoo-JeongVolume:
164
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.07.012
Date:
October, 2016
File:
PDF, 1.13 MB
english, 2016