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Hybrid additive manufacturing of 3D electronic systems
Li, J, Wasley, T, Nguyen, T T, Ta, V D, Shephard, J D, Stringer, J, Smith, P, Esenturk, E, Connaughton, C, Kay, RVolume:
26
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/26/10/105005
Date:
October, 2016
File:
PDF, 1.96 MB
english, 2016