Hybrid additive manufacturing of 3D electronic systems

Li, J, Wasley, T, Nguyen, T T, Ta, V D, Shephard, J D, Stringer, J, Smith, P, Esenturk, E, Connaughton, C, Kay, R

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Volume:

Language:

english

Journal:

Journal of Micromechanics and Microengineering

DOI:

10.1088/0960-1317/26/10/105005

Date:

October, 2016

File:

PDF, 1.96 MB

english, 2016

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