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Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead‐free 2nd level interconnections in LTCC/PWB assemblies
Nousiainen, O., Kangasvieri, T., Kautio, K., Rautioaho, R., Vähäkangas, J.Volume:
22
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911011054163
Date:
June, 2010
File:
PDF, 732 KB
english, 2010