Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics
Hong, Won Sik, Oh, Chulmin, Kim, Mi-Song, Lee, Young Woo, Kim, Hui Joong, Hong, Sung Jae, Moon, Jeong TakVolume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4837-2
Date:
December, 2016
File:
PDF, 3.83 MB
english, 2016