Impact of an Elevated Temperature Environment on Sn-Ag-Cu...

Journal of Electronic Materials 2016 / 12 Vol. 45; Iss. 12

Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Lee, Tae-Kyu, Chen, Zhiqiang, Baty, Greg, Bieler, Thomas R., Kim, Choong-Un
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Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4902-x
Date:
December, 2016
File:
PDF, 2.30 MB
english, 2016
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