Incorporating the Johnson–Cook Constitutive Model and a Soft Computational Approach for Predicting the High-Temperature Flow Behavior of Sn-5Sb Solder Alloy: A Comparative Study for Processing Map Development
Vafaeenezhad, H., Seyedein, S. H., Aboutalebi, M. R., Eivani, A. R.Volume:
46
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4887-5
Date:
January, 2017
File:
PDF, 2.12 MB
english, 2017