Microelectromechanical Implants: Encapsulation Concepts and Test Procedures
Betz, W., Trieu, H. K., Vogt, H.Volume:
57
Language:
english
Journal:
Biomedical Engineering / Biomedizinische Technik
DOI:
10.1515/bmt-2012-4292
Date:
January, 2012
File:
PDF, 673 KB
english, 2012